【專利讓與及授權】科技部計畫產出專利公告(4件)-108/06/06

項次

技術名稱

專利證書號

摘要

專利期

1

可攜式遠距居家監測系統及方法

I312673

本發明係為一種可攜式遠距居家監測系統及方法,用以解決習知遠距醫療系統架構規模龐大,所需建設投資大而較缺乏商品化彈性的缺點,本發明提供一種可攜式遠距居家監測系統,使用者可以藉由可攜式電子裝置及應用程式或瀏覽器經由網路向分散式資料伺服器索取所需之居家監測資料,而且本發明之可攜式遠距居家監測系統係以模組化、可攜式為原則,不需專用伺服器主機,所以可減少前述之投資資金的投入以及更具有設計的彈性。

2009/08/01~2026/03/27

2

多重生理監測墊、多重生理監測系統及生理辨識流程方法

I299260

一種多重生理監測墊、多重生理監測系統及生理辨識流程方法,該多重生理監測墊包括一軟質感測墊、一訊號連接線、一生理辨識處理機以及一變壓器;該軟質感測墊係放置於一床鋪或床墊上,該訊號連接線係用以連接該軟質感測墊與該生理辨識處理機,該變壓器係用以供應電源予該多重生理監測墊;當受測者躺於該多重生理監測墊上接受睡眠監測時,不需生理感測貼片貼在受測者身上且不需以束縛帶固定受測者,該受測者可以在自然放鬆之狀態接受睡眠監測。

2008/08/01~2025/12/29

3

可攜式遠距居家監測系統及方法

PORTABLE TELE-HOMECARE MONITORING SYSTEM AND METHOD FOR THE SAME

US8,111,817 B2

A portable tele-homecare monitoring system and method for the same overcomes the problem of medical monitoring requiring a large organized system, with the associated high costs and disadvantages generated due to the large amount of equipment required by the prior art. The present invention allows a user to access home monitoring data by a portable electronic device, an application program or explorer via the Internet from a distributed data server. The portable tele-homecare monitoring system does not require a server and is designed to be modular and portable, so it costs are reduced and so that the design is flexible.

2006/11/09~2030/11/15

4

抑制錫-鎳介金屬於銲點中生成的方法

METHOD FOR INHIBITING GROWTH OF NICKEL-COPPER-TIN INTERMETALLIC LAYER IN SOLDER JOINTS

US8,092,621 B2

A method for inhibiting the growth of a nickel-copper-tin intermetallic (i.e. (Ni,Cu)₃Sn₄) layer at the (Cu,Ni)₆Sn₅/nickel interface of a solder joint is described as follows. A Sn—Ag—Cu solder alloy with a Cu-content of 0.5˜1 weight percent (wt. %) is provided. The solder alloy is disposed on a surface finish of a soldering pad, having a nickel-based metallization layer. A material of the solder alloy further includes palladium. The solder alloy is joined with the surface finish, so as to form the solder joint containing palladium that enables to inhibit the growth of the undesired (Ni,Cu)₃Sn₄ layer between the (Cu,Ni)₆Sn₅ and nickel in the subsequent use at temperatures ranging from 100° C. to 180° C.

2010/05/10~2030/06/10